汉高粘合剂技术事业部主营汉高乐泰工业粘合剂、结构胶，瞬干胶，平面密封胶，圆柱固持胶，汉高乐泰UV紫外线光固化胶，底部填充胶，低温固化环氧胶，密封剂和表面处理产品。在世界粘合剂、密封剂及表面处理领域，汉高是全球市场的领导者，拥有诸如Loctite, Teroson, P3, Hysol, 等众多强大品牌。销\处售\电\话\137、5113、6332.陈生 Q.Q3022/24/564/LOCTITE ECCOBOND UF 3811 reworkable epoxy underfill is
designed for CSP and BGA applications. This low viscosity material is
formulated to flow at room temperature with no additional preheating
required. It cures quickly at moderate temperatures to minimize stress
to other components. When cured, this material has a high glass
transition temperature while maintaining flexibility in order to protect
solder joints during thermal cycling and dro testing.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield CP51, 25 °C, mPa·s (cP):
Speed 20 rpm 354
Specific Gravity 1.16
Pot Life @ 25oC, days 3
Shelf Life @ -20°C, days 365